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New Industrial series Transfer Mold MINI-DIPIPM with Integrated BSD and Temperature Measurement function

New Industrial series Transfer Mold MINI-DIPIPM with Integrated BSD and Temperature Measurement function

A new industrial series transfer mold type mini DIPIPMTM developed for applications like general inverter and servo for small capacity industrial motor drive or package air conditioner is presented.
New DIPIPM+™ Series Module with All-in-one integrated

New DIPIPM+™ Series Module with All-in-one integrated

A new series of DIPIPM+™ power module with all-in-one internal circuit and compact size for industrial applications.

A 1700V-IGBT module and IPM with new insulated metal baseplate (IMB) featuring enhanced isolation properties and thermal conductivity

A 1700V-IGBT module and IPM with new insulated metal baseplate (IMB) featuring enhanced isolation properties and thermal conductivity

An enhanced module insulating technology IMB (Insulated Metal Baseplate) that features a high thermal conductivity and insulation properties and its application to IGBT module and IPM are presented.

New Transfer Mold DIPIPM utilizing silicon carbide (SiC) Mosfet

New Transfer Mold DIPIPM utilizing silicon carbide (SiC) Mosfet

A new transfer mold type full Silicon Carbide (SiC) super-mini DIPIPMTM developed for small capacity motor drive system in both home appliances and industrial applications that higher energy-saving efficiency is needed.
Resin Encapsulation Combined with Insulated Metal Baseplate for Improving Power Module Reliability

Resin Encapsulation Combined with Insulated Metal Baseplate for Improving Power Module Reliability

A newly developed packaging technology in combination with direct potting (DP) resin and Insulated Metal Baseplate (IMB) is presented
7th Generation IGBT Module for Industrial Applications

7th Generation IGBT Module for Industrial Applications

we introduce the technology applied to the 7th generation IGBT modules with miniaturized size and reduced weight.

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